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Bringing science to comfortable living through advanced Kiru, Kezuru, Migaku technologies.
Kiru: Cutting, Kezuru: Grinding, Migaku: Polishing
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Kiru, Kezuru, Migaku Topics
Cutting and Planarization Using a Surface Planer New!
Blade Dicing
Laser Dicing
Stealth Dicing Application
Grinding
Stress Relief
Cutting using a water jet saw
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Dicing New!
Applications Support
Grinding
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DBG
 
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To Achieve a Better Process Condition
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SEMICON Japan 2008
News Release
Archives
Investors
[November 17, 2008]
Compact 600 mm-wide DAL7020 Compact Laser Saw Development
[November 12, 2008]
Financial Report for the Second Quarter Ended Sep 30, 2008 (Consolidated)
Notification of Revision of Business Forecast (Fiscal Year 2008)
DISCO Announces a Dividend Payment and a Revision to the Dividend Payment Forecast for Fiscal Year 2008
[November 4, 2008]
Announcing the debut of the DWR1720 deionized water recycling unit for dicing saws that totally eliminates water waste
[October 31, 2008]
The dedicated website regarding SEMICON Japan 2008 has been released.
[October 28, 2008]
DISCO to Use Kaspersky Labs Japan Products as Built-in Security Solutions in its Precision Processing Equipment for First Time
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