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Press Release

August 7, 2012

Expansion of DISCO HI-TEC EUROPE's Munich Office

DISCO Corporation (Head Office: Ota-ku, Tokyo, President: Kazuma Sekiya) will expand our Munich office to further improve and accelerate the service framework for the European market.

Background / Purpose
In recent years, R&D needs in the European market have intensified not only for conventional semiconductors and electronics parts, but also for high value-added devices such as MEMS for acceleration speed sensors in smartphones, power devices for automobiles, and ultrasonic wave oscillators for the healthcare industry.
Furthermore, increasing demand for the Dicing and Grinding Service has required DISCO to further enhance our support framework.
In order to meet these needs, DISCO will construct a new building adjacent to the existing one to expand the testing booths and clean rooms. This will triple the space available for process testing and the Dicing and Grinding Service, allowing us to more speedily provide solutions to our customers.


Overview of the expansion construction

Scheduled start

:

August 2012

Scheduled completion

:

January 2013

Structure

:

Reinforced concrete/3 floors above ground

Construction cost

:

About 4.5M Euros
(Expenses for acquisition of the expansion site and construction)

Total floor area

:

About 3,000 m²(before expansion: about 1,600 m²)

Processing facilities

:

About 1,050 m²(before expansion: about 340 m²)

Land area

:

About 6,500 m² (before expansion: about 2,000 m²)


Overview of the Europe office

Name

:

DISCO HI-TEC EUROPE GmbH

Location

:

Muenchen, Germany

Business details

:

Sales and maintenance of DISCO's precision processing equipment, blades/wheels and related machines; applications support and consigned processing services.



Concept of completion (new premises on the right)
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