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DISCO HOME > Product Information > Grinders

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Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy.
Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*.
*Limited to certain models
DFG8540 DFG8560 DFG8830 DAG810
DFG8540 DFG8560 DFG8830 DAG810
Max. Workpiece size mm ø200 ø300 ø150 ø200
Spindle Number of axes   2 4 1
Output (Z1 - Z3) kW 4.2 4.8 6.3 4.2
Revolution speed (Z1 - Z3) min-1 1,000 - 7,000 1,000 - 4,000 1,000 - 7,000
Number of chuck tables 3 5 1
Grinding Accuracy Thickness variation
(within one wafer / between wafers)
μm Within 1.5, ±3.0 or less Within 3.0, ±3.0 or less Within 1.5 (within one wafer)
Surface roughness μm Ry 0.13(#2000)
Ry 0.15(#1400)
- Ry 0.13(#2000)
Ry 0.15(#1400)
Utilities Dimensions (WxDxH) mm 1,200 x 2,670 x 1,800 1,400 x 3,322 x 1,800 1,400 x 2,500 x 2,000 600 x 1,770 x 1,780
Weight kg Approx. 3,100 Approx. 4,000 Approx. 6,000 Approx. 1,300
* Click the equipment photo to open the product catalog (PDF).

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