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DISCO HOME > Product Information > Grinding Wheels

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Grinding Wheels

DISCO's grinding wheels grind silicon, compound semiconductors, crystals, and a wide variety of other materials. They are an essential part of DISCO's excellent Kezuru (Grinding) solutions.

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Rotation Speed Limit
Safety Data Sheet (SDS)


Series Application Feature
GF01 Series/GF01 Series BT100 GF01
Series
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. New wheel series featuring advanced coolant water delivery
GF01 Series BR385 GF01
Series
BR385
Borosilicate glass, non-alkali glass, crystal,various glass types, etc. Porous vitrified bond, fixed abrasive wheels resulting in high quality grinding of SiC wafers.
GS08 Series GS08
Series
SiC, Al2O3, Si3N4, etc. Porous vitrified bond, fixed abrasive wheels resulting in high quality grinding of SiC wafers.
IF Series IF
Series
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. Standard grinding wheels with extensive record of success
Poligrind Poligrind Silicon wafers, etc. ultra-high-quality grinding
UltraPoligrind Ultra
Poligrind
Silicon wafers, etc. Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc.
RS Series RS
Series
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. This new finish grinding wheel achieves high die strength while maintaining gettering performance.
* The DFG-83H/6 is no longer sold, however the supply of the RS Series continues.
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