DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Product Information > Laser saws

Product Information


Laser saws

Laser saws make use of the characteristics of lasers to achieve high speed, high accuracy, and high quality processing of composite materials and difficult-to-cut materials.
Laser processing method introduction  
Ablation processing
A processing method for full cutting or full grooving in which solids are vaporized or sublimated by focusing laser energy on an extremely small area for a very short length of time.
DBG + DAF Laser Cut
Laser Full Cut Dicing
Low-k Grooving
Stealth dicing
This is a dicing method that forms a modified layer in the workpiece, by focusing a laser inside the workpiece, and then implements die separation with a machine such as a tape expander.
Stealth Dicing Application
Laser-lift off
Detaching the material layer from the substrate by irradiating a laser on the material layer formed on the substrate.
Equipment for ablation  
For 150mm
For 300mm
DAL7020 DFL7020
DAL7020 DFL7020
Max. Workpiece size mm ø150
Processing method   Automatic Fully automatic
X-axis Max. feed speed mm/s 0.1 - 300
Y-axis Positioning accuracy mm Within 0.003/160
Utilities Dimensions (WxDxH) mm 600 x 1,500 x 1,530 1,050 x 1,530 x 1,650
Weight kg Approx. 810 Approx. 1,310
DFL7161 DFL7160 DFL7260
DFL7161 DFL7160 DFL7260
Max. Workpiece size mm ø300
Processing method   Fully automatic
X-axis Max. feed speed mm/s 1.0 - 1,000 0.1 - 600 1.0 - 1,000
Y-axis Positioning accuracy mm Within 0.003/310 Within 0.002/310
Utilities Dimensions (WxDxH) mm 1,560 x 1,550 x 1,800 1,200 x 1,550 x 1,800 2,800 x 1,220 x 1,800
Weight kg Approx. 2,300 Approx. 1,750 Approx. 2,900
※ DFL7260:  A chiller unit is placed outside the machine. 1200 x 650 x 1558 mm (chiller unit dimensions)
* Click the equipment photo to open the product catalog (PDF).

Equipment for stealth dicing  
For 200mm
For 300mm
DFL7341 DFL7340
DFL7341 DFL7340
Max. Workpiece size mm ø200
Processing method   Fully automatic
X-axis Max. feed speed mm/s 1.0 - 1,000
Y-axis Positioning accuracy mm Within 0.003/210
Utilities Dimensions (WxDxH) mm 950 x 1,732 x 1,800 1,000 x 1,800 x 1,990
Weight kg Approx. 1,800 Approx. 1,960
DFL7361 DFL7360 DFL7360FH
DFL7361 DFL7360 DFL7360fh
Max. Workpiece size mm ø300
Processing method   Fully automatic
X-axis Max. feed speed mm/s 0.1 - 1,000 1.0 - 1,000
Y-axis Positioning accuracy mm Within 0.003/310
Utilities Dimensions (WxDxH) mm 1,210 x 3,270 x 1,906 1,715 x 3,265 x 1,998 1,100 x 2,100 x 1,990
Weight kg Approx. 2,570 Approx. 2,770 Approx. 2,090
* Click the equipment photo to open the product catalog (PDF).

Equipment for laser lift-off  
DFL7560L
DFL7560L
Max. Workpiece size mm ø150
Processing method   Fully automatic
Utilities Dimensions (WxDxH) mm 2,000 x 1,810 x 1,800
Weight kg Approx. 3,300
* Please note that if you perform laser lift-off (LLO) processing, you may infringe
Japanese Patent No. 4258776 or its corresponding foreign patents.
* Click the equipment photo to open the product catalog (PDF).

*

The above specifications may change due to technical modifications. Please confirm when placing your order.

Back To Top

Product Information
Precision Machines
 
 
Precision Processing Tools
 
 
Other Products
 
 
Downloads
 
 

Used semiconductor equipment
Trade Show Information

Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top