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Grinder / Polisher

Grinder/polishers can complete every step of the process from wafer backgrinding to dry polishing on the same chuck table for high stability processing to very thin finish thicknesses.
Support for applications which use the DBG system or DAF (die attach film) is also possible by incorporating a wafer mounter with the grinder/polisher into an inline system.
Max. Workpiece size mm ø300
Spindle Number of axes   3
Output (Z1-Z3) kW 6.3
Revolution speed (Z1-Z3) min-1 1,000 - 4,000
Number of chuck tables 4
Grinding accuracy Thickness variation
(within one wafer / between wafers)
μm Within 2.5, ±2.5 or less
Surface roughness μm Ra 0.005 or less
Utilities Dimensions (WxDxH) mm 1,690 x 3,315 x 1,800
Weight kg Approx. 6,700
* Click the equipment photo to open the product catalog (PDF).


Polishers utilize a dry polishing process to remove stresses on the wafer backside introduced by grinding. The dry polishing process is complete water and chemical free and minimizes the burden on the environment.
DFP8140 DFP8160
DFG8540 DFG8560
Max. Workpiece size mm ø200 ø300
Spindle Number of axes   1
Output (Z1 - Z3) kW 4.8 7.5
Revolution speed (Z1 - Z3) min-1 1,000 - 4,000 1,000 - 3,000
Number of chuck tables 1
Processing accuracy Thickness variation
(within one wafer / between wafers)
μm ±1.0 or less (when removing 2 μm in average, within one wafer)
Utilities Dimensions (WxDxH) mm 1,200 x 2,670 x 1,800 1,400 x 3,322 x 1,800
Machine weight kg Approx. 1,900 Approx. 2,400
* Click the equipment photo to open the product catalog (PDF).

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