DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Sitemap

Sitemap


News Releases

News Releases
Event Schedule

Product Information

Dicing and Cutting Saws
Laser Saws
Grinders
Polishers and Dry Etchers
Die Separator
Surface Planer
WaterJet Saw
Products for New Processes
 
Products for DBG Process
Products for Package Singulation
Dicing Blades
 
ZHDG Series
ZH05 Series
ZHCR Series
ZHRF Series
ZHFX Series
ZHZZ Series
NBC-ZH Series
Z09 Series
Z05 Series
ZP07 Series
NBC-Z Series
B1A Series
P1A Series
R07 Series
VT07/12 Series
A1A/K1A Series
Grinding Wheels
 
IF Series
GF01 Series
GF01 Series BR385
GS08 Series
Poligrind
UltraPoligrind
Dry Polishing Wheels
 
Gettering DP
DP08 Series
DP Series
For Your Safety
Accessory Equipment
 
Ultrasonic-wave Dicing Unit
Deionized Water Recycling Unit
Water Temperature Control Units
Resistivity Management Unit
Automatic Cleaning System
Related Products
 
StayClean-F
StayClean-A
StayClean Injector
Catalog Downloads
SECS/GEM Communication Specification Downloads
AntiVirus Manual

About DISCO

Corporate Outline
 
Affiliates
Organization Chart and List of Executives
Corporate Philosophy
Corporate Profile Movie
DISCO Corporate History
Your Nearest DISCO Office
Business calendar

CSR

Message from the President
Organizational Management
Raising Customer Satisfaction
Creating Workplaces Conducive to Work
Investors
Partnerships with Suppliers
Social Contribution Activities
Addressing Global Environmental Problems

Contact

Solutions

Blade Dicing
 
Dicing Thin Wafers
Debris and Particle Removal
QFN Package Processing
Laser Dicing
 
Processing Sapphires with Lasers
Stealth Dicing Application
DBG + DAF Laser Cut
Laser Full Cut Dicing
Low-k Grooving
Grinding
 
Ultra-Thin Grinding
TAIKO Process
Stress Relief
 
Stress Relief (Dry Polishing)
DBG & Dry Etcher Process Flow
DBG
 
Dicing Before Grinding (DBG) Process
Others
 
Florescent resin color stabilization using the Surface Planer
DWR1720 Deionized Water Recycling Unit
Cutting and Planarization Using a Surface Planer
Cutting Using a WaterJet Saw
Dicing Application with Ultrasonic Technology
Dicing application with ultrasonic technology
Applications Example
Applications Support
Dicing and Grinding Service

Customer Support

Training Services
 
How to apply for training
Course List
Training Service Introduction
How to get to the Training Center
FAQ
Design Change Notification
Useful Improvement Information
After-Sales Service
Used semiconductor equipment
Inspection Sheet Search
End-of-life Product Recycling Initiative
Certificate of Non-use of DISCO Restricted Substances
SDS
Discontinued Machines List
Your Nearest DISCO Office
 
Japan
USA
Asia
Europe

Customer Satisfaction

Research and Development
Machine Customization
High-Quality Manufacturing
Quality Management System
  Customer Satisfaction Initiatives
 
DISCO Customer Satisfaction Charter
Commitment to Customer Satisfaction Enhancement
CS Management System
Customer Satisfaction Survey System
Improvement Activities
Customer Satisfaction Survey Results
Building Emergency Procedures
 
Establishing an earthquake-proof manufacturing base
Preparing for a new type influenza pandemic
Customer support system in an emergency
Preparing people for a disaster
Systems to maintain and improve BCM

Investors

DISCO Management
Financial Highlights
IR Library
Shares
IR Calendar
IR News
Request for Information
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top