Countermeasure for Preventing Particle Adhesion in Die LED Processing
One of the concerns when dicing die LED is the deterioration of brightness caused by adhesion of particles on the silicon resin section. StayClean-A is very effective for preventing such particle adhesion.
Die LEDs have the following configurations.
Aims at diffusing light
Usage: Lighting, etc.
Focuses on light extraction efficiency and stability
Use of StayClean-A in the die LED dicing enables preventing particle adhesion on the silicon resin section, thereby reducing the deterioration of the brightness.
D.I. water + StayClean-A (0.1%)
Fig2. Silicon resin surface photographs (DISCO internal test results)